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ESD防护芯片
ESD防护芯片

Product status

Unidirectional/bidirectional

Channel

Top Metal

Back Metal

Die Size

Die Size (Width/um)

Wafer Saw(um)

Thickness(um)

Vrwm(V)

Vbr([email protected])

IR(uA)

Cj(pf)

Ipp(A)

Vcc([email protected])

ESD(kV)

  
型号 pdf Unidirectional
/bidirectional
Channel Top Metal Back Metal Die Size (Length/um) Die Size (Width/um) Wafer Saw(um) Thickness(um) Vrwm(V) Vbr([email protected]) IR(uA) Cj(pf) Ipp(A) Vcc([email protected]) ESD(kV) 产品状态

条数据